Power Device Wafer & Package Test Engineer
STMicro
STMicroelectronics in Italy is seeking a candidate to plan, execute, and analyze package/wafer level tests for reliability in our power device prototypes (SiC, IGBT, GaN) and bench characterization.
You will join a global team, require a master's in physics or related field, about 2 years' experience, strong English, and skills in programming and numerical modeling. The role offers a competitive salary and growth opportunities.
#J-18808-LjbffrOfferta di lavoro pubblicata 1 giorno fa
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