Principal HS Digital Design Engineer (d/m/f)

ppWe are LSP – Light Sensors Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments. /p ul liTechnical leader responsible for architecture and RTL development of high-speed digital subsystems for communication ICs and mixed-signal SoC products /li liDefine digital subsystem architectures /li liLead RTL development and integration /li liDrive design reviews and quality standards /li liSupport verification and implementation teams /li liMentor design engineers /li /ul ul liMSc or PhD in Electrical Engineering /li li10+ years digital IC design experience /li liRTL design (Verilog/SystemVerilog) /li liHigh-speed digital IC design experience for communication or mixed-signal SoC products is required; knowledge of high-speed interfaces such as UCIe, PCIe or similar protocols is an advantage /li liInterface protocols and clock-domain crossing /li liSynthesis and timing analysis /li liAdvanced CMOS node experience, including FinFET and/or FD-SOI, is required /li /ul /p #J-18808-Ljbffr